{"id":1884,"date":"2023-11-08T13:17:18","date_gmt":"2023-11-08T13:17:18","guid":{"rendered":"https:\/\/www.mintecinno.com\/?p=1884"},"modified":"2023-11-08T13:25:50","modified_gmt":"2023-11-08T13:25:50","slug":"how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process","status":"publish","type":"post","link":"https:\/\/www.mintecinno.com\/de\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/","title":{"rendered":"Wie l\u00e4sst sich die Verformung von Leiterplatten bei der PCBA-Herstellung w\u00e4hrend des SMT-Prozesses verhindern?"},"content":{"rendered":"

Wie man die Verformung von Leiterplatten bei der PCBA-Herstellung w\u00e4hrend des SMT-Prozesses verhindert<\/h1>\n

W\u00e4hrend der Surface Mount Technology (SMT<\/a>) Herstellungsverfahren, Leiterplatten (PCBs<\/a>) k\u00f6nnen sich verziehen, was zu verschiedenen Defekten f\u00fchrt, wie z. B. einer falschen Ausrichtung der Komponenten und Grabsteinbildung. In diesem Artikel werden wir wirksame Methoden er\u00f6rtern, die von Shenzhen PCBA<\/a> Hersteller, um eine Verformung der Leiterplatte w\u00e4hrend PCBA<\/a> Herstellung:<\/p>\n

1. Temperaturkontrolle:<\/h2>\n

Das Temperaturmanagement ist von entscheidender Bedeutung, da es die Hauptbelastungsquelle f\u00fcr Leiterplatten darstellt. Eine Senkung der Temperatur im Reflow-Ofen oder eine Anpassung der Heiz- und K\u00fchlraten w\u00e4hrend des Reflow-Prozesses kann die Belastung der Leiterplatten erheblich verringern. PCB<\/a> Verzug. Dieser Ansatz muss jedoch sorgf\u00e4ltig abgewogen werden, da niedrigere Temperaturen zu Problemen wie L\u00f6tbr\u00fccken f\u00fchren k\u00f6nnen.<\/p>\n

2. Materialien mit hohem Tg-Wert:<\/h2>\n

Tg oder Glas\u00fcbergangstemperatur ist der Punkt, an dem ein Material von einem festen, glasartigen Zustand in einen gummiartigen Zustand \u00fcbergeht. Materialien mit niedrigeren Tg-Werten werden beim Reflow schneller weich und bleiben l\u00e4nger in einem gummiartigen Zustand. Dies kann zu einer st\u00e4rkeren Verformung der Leiterplatte f\u00fchren. Um die Widerstandsf\u00e4higkeit einer Leiterplatte gegen\u00fcber spannungsbedingten Verformungen zu verbessern, k\u00f6nnen sich die Hersteller f\u00fcr Materialien mit h\u00f6heren Tg-Werten entscheiden, auch wenn dies mit h\u00f6heren Kosten verbunden sein kann.<\/p>\n

3. Erh\u00f6hung der Plattendicke:<\/h2>\n

Viele elektronische Ger\u00e4te streben nach einem schlanken Design, was zu PCB<\/a> Dicken von nur 1,0 mm, 0,8 mm oder sogar 0,6 mm. Diese ultrad\u00fcnnen Leiterplatten sind anf\u00e4lliger f\u00fcr Verformungen beim Reflow-L\u00f6ten. Wenn eine geringe Dicke nicht unbedingt erforderlich ist, empfiehlt es sich, Leiterplatten mit einer Dicke von 1,6 mm zu verwenden. Dies verringert das Risiko von PCB<\/a> Verwerfungen und Verformungen.<\/p>\n

4. Abmessungs- und Panelisierungsmanagement:<\/h2>\n

Da die meisten Reflow-\u00d6fen Kettenf\u00f6rderer f\u00fcr den Transport verwenden PCBs,<\/a> gr\u00f6\u00dfere Platten neigen aufgrund ihres Eigengewichts eher zum Durchh\u00e4ngen oder Verformen. Um die Verformung zu minimieren, empfiehlt es sich, die l\u00e4ngere Seite der Platine parallel zur F\u00f6rderkette auszurichten. Au\u00dferdem hilft es, die Anzahl der Platten w\u00e4hrend des Reflow-L\u00f6tens zu reduzieren, indem die schmalen Seiten senkrecht zur F\u00f6rderrichtung ausgerichtet werden.<\/p>\n

5. Reflowl\u00f6t-Tr\u00e4ger oder -Halterungen:<\/h2>\n

Wenn sich andere Methoden als schwierig erweisen, kann die Verwendung von Reflow-L\u00f6thalterungen die L\u00f6sung sein, um die Verformung von Leiterplatten zu minimieren. Diese Halterungen, die in der Regel aus Materialien wie Aluminiumlegierungen oder Kunststein bestehen, sind f\u00fcr ihre Hochtemperaturbest\u00e4ndigkeit bekannt. Sie stabilisieren die Leiterplatte w\u00e4hrend der Hochtemperaturexpansion und der anschlie\u00dfenden Abk\u00fchlung und bewahren die PCB<\/a>bis die Temperatur unter den Tg-Punkt f\u00e4llt. In diesem Stadium wird die PCB<\/a> seine Steifigkeit wiedererlangt. In F\u00e4llen, in denen einlagige Spannvorrichtungen nicht ausreichen, k\u00f6nnen doppellagige Spannvorrichtungen mit einer Abdeckung die Verformung der Leiterplatte weiter verringern. Es ist jedoch anzumerken, dass solche Vorrichtungen kostspielig sein k\u00f6nnen und zus\u00e4tzliche Arbeitskr\u00e4fte f\u00fcr den Auf- und Abbau erfordern.<\/p>\n

6. Router f\u00fcr die Entflechtung:<\/h2>\n

Da V-Cut die strukturelle Integrit\u00e4t von Leiterplatten mit Paneelen schw\u00e4chen kann, ist es ratsam, V-Cut zu vermeiden oder seine Tiefe zu minimieren.<\/p>\n

Diese Methoden spielen eine entscheidende Rolle, wenn es darum geht, Leiterplattenherstellern dabei zu helfen, Probleme mit der Verformung von Leiterplatten w\u00e4hrend des SMT-Fertigungsprozesses zu vermeiden und so die Produktion von qualitativ hochwertigen Leiterplattenbaugruppen (PCBAs<\/a>). F\u00fcr weitere Informationen. Bitte kontaktieren Sie MTI PCBA<\/a>.<\/p>","protected":false},"excerpt":{"rendered":"

How to Prevent PCB Warping in PCBA Manufacturing during SMT Process During the Surface Mount Technology (SMT) manufacturing process, Printed Circuit Boards (PCBs) can experience warping, leading to various defects such as component misalignment and tombstoning. In this article, we will discuss effective methods employed by Shenzhen PCBA manufacturers to prevent PCB warping during PCBA […]<\/p>","protected":false},"author":3,"featured_media":1849,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_joinchat":[],"footnotes":""},"categories":[16],"tags":[],"class_list":["post-1884","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"yoast_head":"\nShenzhen PCB Assembly SMT Assembly MTI PCBA EMS Partner<\/title>\n<meta name=\"description\" content=\"Learn how Shenzhen PCBA manufacturers avoid PCB warping during SMT assembly. Discover effective methods, from temperature control to high Tg materials, ensuring high-quality PCBA\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.mintecinno.com\/de\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Shenzhen PCB Assembly SMT Assembly MTI PCBA EMS Partner\" \/>\n<meta property=\"og:description\" content=\"Learn how Shenzhen PCBA manufacturers avoid PCB warping during SMT assembly. Discover effective methods, from temperature control to high Tg materials, ensuring high-quality PCBA\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.mintecinno.com\/de\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/\" \/>\n<meta property=\"og:site_name\" content=\"MTI PCBA\" \/>\n<meta property=\"article:published_time\" content=\"2023-11-08T13:17:18+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-11-08T13:25:50+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/10\/Industrial-PCBA-2.png\" \/>\n\t<meta property=\"og:image:width\" content=\"800\" \/>\n\t<meta property=\"og:image:height\" content=\"800\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"author\" content=\"administrator\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Verfasst von\" \/>\n\t<meta name=\"twitter:data1\" content=\"administrator\" \/>\n\t<meta name=\"twitter:label2\" content=\"Gesch\u00e4tzte Lesezeit\" \/>\n\t<meta name=\"twitter:data2\" content=\"3\u00a0Minuten\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.mintecinno.com\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/\",\"url\":\"https:\/\/www.mintecinno.com\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/\",\"name\":\"Shenzhen PCB Assembly SMT Assembly MTI PCBA EMS Partner\",\"isPartOf\":{\"@id\":\"https:\/\/www.mintecinno.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.mintecinno.com\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.mintecinno.com\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/10\/Industrial-PCBA-2.png\",\"datePublished\":\"2023-11-08T13:17:18+00:00\",\"dateModified\":\"2023-11-08T13:25:50+00:00\",\"author\":{\"@id\":\"https:\/\/www.mintecinno.com\/#\/schema\/person\/5165da83d54c7e4dccc90cbb37d02b71\"},\"description\":\"Learn how Shenzhen PCBA manufacturers avoid PCB warping during SMT assembly. 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