{"id":1893,"date":"2023-12-01T14:16:27","date_gmt":"2023-12-01T14:16:27","guid":{"rendered":"https:\/\/www.mintecinno.com\/?p=1893"},"modified":"2024-04-09T03:45:41","modified_gmt":"2024-04-09T03:45:41","slug":"addressing-welding-failures-in-smt-production-due-to-missing-drill-files","status":"publish","type":"post","link":"https:\/\/www.mintecinno.com\/de\/addressing-welding-failures-in-smt-production-due-to-missing-drill-files\/","title":{"rendered":"Behebung von Schwei\u00dffehlern in der SMT-Produktion aufgrund von fehlenden Bohrdateien"},"content":{"rendered":"<p>Wenn es um die Oberfl\u00e4chenmontagetechnik (<a href=\"https:\/\/www.mintecinno.com\/de\/\">SMT<\/a>) sind F\u00e4lle von Schwei\u00dffehlern, die auf fehlende Bohrerfeilen zur\u00fcckzuf\u00fchren sind, keine Seltenheit.<\/p>\n<p>L\u00f6tpastendruck in <a href=\"https:\/\/www.mintecinno.com\/de\/\">SMT<\/a> Schwei\u00dfen ist ein entscheidender und recht komplexer Prozess, wobei Daten darauf hindeuten, dass 60-70% der Defekte in <a href=\"https:\/\/www.mintecinno.com\/de\/\">SMT<\/a> Produktion stammen aus dem Lotpastendruck.<\/p>\n<p>Interessanterweise sind diese Fehler nicht ausr\u00fcstungsbedingt, sondern treten vor allem bei technischen Bewertungen und Schablonenoptimierungen auf. Insbesondere das Fehlen von Bohrdateien w\u00e4hrend des Engineerings kann zu verschiedenen <a href=\"https:\/\/www.cenpcba.com\/pcb-assembly\/\">SMT<\/a> Schwei\u00dffehler.<\/p>\n<p>Nach Angaben der technischen Abteilung von Unternehmen E in den gro\u00dfen Schwei\u00dffabriken wurden etwa 15% an <a href=\"https:\/\/www.mintecinno.com\/de\/\">SMT<\/a> In Schwei\u00dfkoffern fehlen die Dateien f\u00fcr die Bohrebenen. Dieses Vers\u00e4umnis f\u00fchrt t\u00e4glich zu mindestens einem oder mehreren Auftr\u00e4gen, bei denen die Kunden diese wichtigen Dateien nicht bereitstellen. Dadurch entstehen erhebliche Kommunikationskosten, die auf etwa 100 Minuten pro Tag und \u00fcber 43 Stunden pro Monat gesch\u00e4tzt werden, die durch den E-Mail-Austausch zwischen Ingenieuren, PMC und Kunden entstehen, um diese Anforderungen zu best\u00e4tigen und zu erf\u00fcllen.<\/p>\n<p>Die Schablone spielt eine zentrale Rolle bei <a href=\"https:\/\/www.mintecinno.com\/de\/\">SMT<\/a> Schwei\u00dfen und erfordert einen systematischen Ansatz, der \u00fcber das einfache Bohren von L\u00f6chern hinausgeht. Es ist wichtig zu verstehen, wie das Eindringen von Zinn, das zu Problemen beim L\u00f6ten f\u00fchrt, verhindert werden kann, wie die Notwendigkeit des Bohrens von Schichtdateien f\u00fcr die Schablonenkonstruktion aussieht und wie verschiedene praktische F\u00e4lle behandelt werden k\u00f6nnen.<\/p>\n<ol>\n<li>Probleme treten zum Beispiel auf, wenn Randl\u00f6cher auf L\u00f6tpads nicht erkannt werden, weil keine Bohrfeilen vorhanden sind. Die Folge: unbefriedigende L\u00f6tungen, falsche L\u00f6tungen und unzureichendes Zinn in Widerst\u00e4nden oder Steckern.<img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-1894 aligncenter\" src=\"https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/12\/1701439007903.png\" alt=\"\" width=\"312\" height=\"231\" srcset=\"https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/12\/1701439007903.png 312w, https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/12\/1701439007903-300x222.png 300w\" sizes=\"auto, (max-width: 312px) 100vw, 312px\" \/><\/li>\n<\/ol>\n<p>2. In \u00e4hnlicher Weise f\u00fchrt das Fehlen von Vermeidungsl\u00f6chern in QFN-Massel\u00f6tpads zu Zinneintritt und falschen L\u00f6tungen. Hier ist es von entscheidender Bedeutung, die Zinnf\u00fcllung in den L\u00f6chern zu vermeiden oder zu erh\u00f6hen, um eine ausreichende Abdeckung zu gew\u00e4hrleisten. Das Fehlen von Dateien mit Bohrebenen verhindert die rechtzeitige Erkennung und Vermeidung solcher Probleme bei der Schablonenerstellung.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-1895 aligncenter\" src=\"https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/12\/2.png\" alt=\"\" width=\"732\" height=\"364\" srcset=\"https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/12\/2.png 732w, https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/12\/2-300x149.png 300w, https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/12\/2-705x351.png 705w\" sizes=\"auto, (max-width: 732px) 100vw, 732px\" \/><\/p>\n<p>Au\u00dferdem ist die \u00fcberst\u00fcrzte Erstellung von Schablonen ohne physische Pr\u00fcfung der <a href=\"https:\/\/www.cenpcba.com\/pcb-assembly\/\">PCB<\/a> nackte Platine kann zu Problemen f\u00fchren. Wenn Kunden keine Dateien mit Bohrebenen zur Verf\u00fcgung stellen, k\u00f6nnen bei der Schablonenerstellung Probleme wie unvorhergesehene Durchgangsl\u00f6cher entstehen, die zu Schwei\u00dfanomalien f\u00fchren.<\/p>\n<p>Um diese Probleme zu entsch\u00e4rfen, ist es wichtig, die Durchgangsl\u00f6cher der Platten auf Sp\u00e4ne zu untersuchen und einen Abstand zwischen den Sp\u00e4nen einzuhalten.<a href=\"https:\/\/www.mintecinno.com\/de\/\">Durchgangsbohrungen und SMDs<\/a>und verstehen die Bedeutung von Harz-Plughole-Galvanisierungsprozessen in <a href=\"https:\/\/www.cenpcba.com\/pcb-assembly\/\">PCB<\/a> Entwurf.<img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-1896 aligncenter\" src=\"https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/12\/3.png\" alt=\"\" width=\"851\" height=\"656\" srcset=\"https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/12\/3.png 851w, https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/12\/3-300x231.png 300w, https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/12\/3-768x592.png 768w, https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/12\/3-705x543.png 705w\" sizes=\"auto, (max-width: 851px) 100vw, 851px\" \/><\/p>\n<p>Zusammenfassend l\u00e4sst sich sagen, dass durch die Vermeidung von Durchgangsl\u00f6chern und die Bereitstellung von Bohrschichtdateien f\u00fcr die Schablonenkonstruktion die Schwei\u00dfqualit\u00e4t erheblich verbessert werden kann. Dies hilft nicht nur bei der pr\u00e4zisen Identifizierung von L\u00f6chern, sondern verhindert auch unn\u00f6tige oder unzureichende L\u00f6cher und beugt so potenziellen Qualit\u00e4tsrisiken aufgrund schlechter Designentscheidungen vor.<\/p>","protected":false},"excerpt":{"rendered":"<p>When it comes to Surface Mount Technology (SMT) production, cases of welding failure caused by missing drill files are not uncommon. Solder paste printing in SMT welding is a crucial and rather complex process, with data suggesting that 60-70% of defects in SMT production stem from solder paste printing. Interestingly, these defects are not equipment-related [&hellip;]<\/p>","protected":false},"author":3,"featured_media":1896,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_joinchat":[],"footnotes":""},"categories":[16],"tags":[],"class_list":["post-1893","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Addressing Welding Failures in SMT Production<\/title>\n<meta name=\"description\" content=\"Explore the impact of missing drill files in Surface Mount Technology (SMT) production, uncovering the causes of welding failures\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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