{"id":1884,"date":"2023-11-08T13:17:18","date_gmt":"2023-11-08T13:17:18","guid":{"rendered":"https:\/\/www.mintecinno.com\/?p=1884"},"modified":"2023-11-08T13:25:50","modified_gmt":"2023-11-08T13:25:50","slug":"how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process","status":"publish","type":"post","link":"https:\/\/www.mintecinno.com\/es\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/","title":{"rendered":"\u00bfC\u00f3mo evitar el alabeo de la PCB en la fabricaci\u00f3n de PCBA durante el proceso SMT?"},"content":{"rendered":"<h1>C\u00f3mo evitar el alabeo de la PCB en la fabricaci\u00f3n de PCBA durante el proceso SMT<\/h1>\n<p>Durante la tecnolog\u00eda de montaje en superficie <a href=\"https:\/\/www.mintecinno.com\/es\/\">(SMT<\/a>), los circuitos impresos (<a href=\"https:\/\/www.mintecinno.com\/es\/\">PCB<\/a>) pueden experimentar alabeo, lo que provoca diversos defectos como la desalineaci\u00f3n de componentes y el tombstoning. En este art\u00edculo analizaremos m\u00e9todos eficaces empleados por Shenzhen <a href=\"https:\/\/www.mintecinno.com\/es\/\">PCBA<\/a> fabricantes para evitar el alabeo de la placa de circuito impreso durante <a href=\"https:\/\/www.mintecinno.com\/es\/\">PCBA<\/a> fabricaci\u00f3n:<\/p>\n<h2>1. Control de temperatura:<\/h2>\n<p>La gesti\u00f3n de la temperatura es vital porque es la principal fuente de tensi\u00f3n para las placas de circuito impreso. La reducci\u00f3n de la temperatura en el horno de reflujo o el ajuste de las velocidades de calentamiento y enfriamiento durante el proceso de reflujo pueden mitigar significativamente <a href=\"https:\/\/www.mintecinno.com\/es\/\">PCB<\/a> alabeo. Sin embargo, este enfoque debe equilibrarse cuidadosamente, ya que las temperaturas m\u00e1s bajas pueden provocar problemas como la formaci\u00f3n de puentes de soldadura.<\/p>\n<h2>2. Materiales de alta Tg:<\/h2>\n<p>La Tg, o temperatura de transici\u00f3n v\u00edtrea, representa el punto en el que un material pasa de un estado s\u00f3lido v\u00edtreo a un estado gomoso. Los materiales con valores de Tg m\u00e1s bajos se ablandan m\u00e1s r\u00e1pidamente durante el reflujo y permanecen en estado gomoso durante m\u00e1s tiempo. Esto puede provocar deformaciones m\u00e1s graves en la placa. Para mejorar la capacidad de una placa de circuito impreso de soportar la deformaci\u00f3n inducida por la tensi\u00f3n, los fabricantes pueden optar por materiales con valores de Tg m\u00e1s altos, aunque esta elecci\u00f3n puede tener un coste m\u00e1s elevado.<\/p>\n<h2>3. Aumento del grosor del tablero:<\/h2>\n<p>Muchos dispositivos electr\u00f3nicos buscan dise\u00f1os delgados, lo que se traduce en <a href=\"https:\/\/www.mintecinno.com\/es\/\">PCB<\/a> espesores tan bajos como 1,0 mm, 0,8 mm o incluso 0,6 mm. Estas placas ultrafinas son m\u00e1s susceptibles de deformarse durante la soldadura por reflujo. Si la delgadez no es un requisito estricto, es aconsejable utilizar placas de circuito impreso con un grosor de 1,6 mm. Esto reduce significativamente el riesgo de <a href=\"https:\/\/www.mintecinno.com\/es\/\">PCB<\/a> alabeo y deformaci\u00f3n.<\/p>\n<h2>4. Gesti\u00f3n de dimensiones y panelizaci\u00f3n:<\/h2>\n<p>Dado que la mayor\u00eda de los hornos de reflujo utilizan transportadores de cadena para transportar <a href=\"https:\/\/www.mintecinno.com\/es\/\">PCB,<\/a> Los tableros m\u00e1s grandes son m\u00e1s propensos a combarse o deformarse debido a su propio peso. Para minimizar la deformaci\u00f3n, se recomienda orientar el lado m\u00e1s largo de la placa en paralelo a la cadena del transportador. Adem\u00e1s, reducir el n\u00famero de placas durante la soldadura por reflujo, colocando los lados estrechos perpendiculares a la direcci\u00f3n del transportador, ayuda a minimizar la deformaci\u00f3n.<\/p>\n<h2>5. 5. Soportes o accesorios de soldadura por reflujo:<\/h2>\n<p>Cuando otros m\u00e9todos resultan complicados, el uso de soportes o accesorios de soldadura por reflujo puede ser la soluci\u00f3n para minimizar la deformaci\u00f3n de las placas de circuito impreso. Estos soportes, normalmente fabricados con materiales como aleaciones de aluminio o piedra sint\u00e9tica, son conocidos por su resistencia a las altas temperaturas. Estabilizan la placa de circuito impreso durante la expansi\u00f3n a alta temperatura y el posterior enfriamiento, preservando la integridad de la placa. <a href=\"https:\/\/www.mintecinno.com\/es\/\">PCB<\/a>hasta que la temperatura descienda por debajo del punto Tg. En este momento, el <a href=\"https:\/\/www.cenpcba.com\/\">PCB<\/a> recupera su rigidez. En los casos en que las fijaciones de una sola capa no son suficientes, las fijaciones de doble capa con una cubierta pueden reducir a\u00fan m\u00e1s la deformaci\u00f3n de la placa de circuito impreso. Sin embargo, hay que tener en cuenta que estas fijaciones pueden ser costosas y requieren mano de obra adicional para su montaje y desmontaje.<\/p>\n<h2>6. Router para la despanelizaci\u00f3n:<\/h2>\n<p>Dado que el corte en V puede debilitar la integridad estructural de las placas de circuito impreso paneladas, es aconsejable evitar el corte en V o minimizar su profundidad.<\/p>\n<p>Estos m\u00e9todos desempe\u00f1an un papel fundamental a la hora de ayudar a los fabricantes de placas de circuito impreso a evitar problemas de alabeo de las placas durante el proceso de fabricaci\u00f3n SMT, garantizando la producci\u00f3n de conjuntos de placas de circuito impreso de alta calidad (<a href=\"https:\/\/www.mintecinno.com\/es\/\">PCBAs<\/a>). Para m\u00e1s informaci\u00f3n. P\u00f3ngase en contacto con <a href=\"https:\/\/www.mintecinno.com\/es\/\">MTI PCBA<\/a>.<\/p>","protected":false},"excerpt":{"rendered":"<p>How to Prevent PCB Warping in PCBA Manufacturing during SMT Process During the Surface Mount Technology (SMT) manufacturing process, Printed Circuit Boards (PCBs) can experience warping, leading to various defects such as component misalignment and tombstoning. In this article, we will discuss effective methods employed by Shenzhen PCBA manufacturers to prevent PCB warping during PCBA [&hellip;]<\/p>","protected":false},"author":3,"featured_media":1849,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_joinchat":[],"footnotes":""},"categories":[16],"tags":[],"class_list":["post-1884","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Shenzhen PCB Assembly SMT Assembly MTI PCBA EMS Partner<\/title>\n<meta name=\"description\" content=\"Learn how Shenzhen PCBA manufacturers avoid PCB warping during SMT assembly. Discover effective methods, from temperature control to high Tg materials, ensuring high-quality PCBA\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.mintecinno.com\/es\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/\" \/>\n<meta property=\"og:locale\" content=\"es_ES\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Shenzhen PCB Assembly SMT Assembly MTI PCBA EMS Partner\" \/>\n<meta property=\"og:description\" content=\"Learn how Shenzhen PCBA manufacturers avoid PCB warping during SMT assembly. Discover effective methods, from temperature control to high Tg materials, ensuring high-quality PCBA\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.mintecinno.com\/es\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/\" \/>\n<meta property=\"og:site_name\" content=\"MTI PCBA\" \/>\n<meta property=\"article:published_time\" content=\"2023-11-08T13:17:18+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-11-08T13:25:50+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/10\/Industrial-PCBA-2.png\" \/>\n\t<meta property=\"og:image:width\" content=\"800\" \/>\n\t<meta property=\"og:image:height\" content=\"800\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"author\" content=\"administrator\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Escrito por\" \/>\n\t<meta name=\"twitter:data1\" content=\"administrator\" \/>\n\t<meta name=\"twitter:label2\" content=\"Tiempo de lectura\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutos\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.mintecinno.com\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/\",\"url\":\"https:\/\/www.mintecinno.com\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/\",\"name\":\"Shenzhen PCB Assembly SMT Assembly MTI PCBA EMS Partner\",\"isPartOf\":{\"@id\":\"https:\/\/www.mintecinno.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.mintecinno.com\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.mintecinno.com\/how-to-prevent-pcb-warping-in-pcba-manufacturing-during-smt-process\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.mintecinno.com\/wp-content\/uploads\/2023\/10\/Industrial-PCBA-2.png\",\"datePublished\":\"2023-11-08T13:17:18+00:00\",\"dateModified\":\"2023-11-08T13:25:50+00:00\",\"author\":{\"@id\":\"https:\/\/www.mintecinno.com\/#\/schema\/person\/5165da83d54c7e4dccc90cbb37d02b71\"},\"description\":\"Learn how Shenzhen PCBA manufacturers avoid PCB warping during SMT assembly. 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