{"id":1893,"date":"2023-12-01T14:16:27","date_gmt":"2023-12-01T14:16:27","guid":{"rendered":"https:\/\/www.mintecinno.com\/?p=1893"},"modified":"2024-04-09T03:45:41","modified_gmt":"2024-04-09T03:45:41","slug":"addressing-welding-failures-in-smt-production-due-to-missing-drill-files","status":"publish","type":"post","link":"https:\/\/www.mintecinno.com\/it\/addressing-welding-failures-in-smt-production-due-to-missing-drill-files\/","title":{"rendered":"Come risolvere i problemi di saldatura nella produzione SMT a causa di file di foratura mancanti"},"content":{"rendered":"

Quando si parla di tecnologia a montaggio superficiale (SMT<\/a>), non sono rari i casi di rottura della saldatura causata da file di foratura mancanti.<\/p>\n

Stampa della pasta saldante in SMT<\/a> La saldatura \u00e8 un processo cruciale e piuttosto complesso, con dati che suggeriscono che 60-70% dei difetti di SMT<\/a> produzione derivano dalla stampa della pasta saldante.<\/p>\n

\u00c8 interessante notare che questi difetti non sono legati alle apparecchiature, ma emergono principalmente durante le valutazioni ingegneristiche e le ottimizzazioni degli stencil. In particolare, l'assenza di file di foratura durante l'ingegnerizzazione pu\u00f2 portare a vari SMT<\/a> difetti di saldatura.<\/p>\n

Secondo i dati forniti dal Dipartimento di Ingegneria della Societ\u00e0 E presso le principali fabbriche di saldatura, circa 15% di SMT<\/a> Nei casi di saldatura mancano i file dei livelli di foratura. Questa omissione comporta almeno uno o pi\u00f9 ordini giornalieri in cui i clienti non forniscono questi file essenziali. Ci\u00f2 comporta notevoli costi di comunicazione, stimati in circa 100 minuti al giorno e oltre 43 ore al mese, dovuti agli scambi di e-mail tra ingegneri, PMC e clienti per confermare e soddisfare questi requisiti.<\/p>\n

Lo stencil gioca un ruolo fondamentale nel SMT<\/a> e richiede un approccio sistematico che vada oltre la semplice foratura. \u00c8 fondamentale capire come prevenire l'ingresso dello stagno che causa problemi di saldatura, la necessit\u00e0 di forare i file di strato per la progettazione di stencil e affrontare vari casi reali.<\/p>\n

    \n
  1. Ad esempio, i problemi sorgono quando i fori sui bordi delle piazzole di saldatura non vengono identificati a causa dell'assenza di file di foratura. La conseguenza: saldature insoddisfacenti, false saldature e stagno inadeguato in resistenze o connettori.\"\"<\/li>\n<\/ol>\n

    2. Allo stesso modo, la mancanza di fori di evitamento nelle piazzole di saldatura di terra QFN provoca l'ingresso di stagno e false saldature. In questo caso, \u00e8 fondamentale evitare o aumentare il riempimento di stagno nei fori per garantire una copertura sufficiente. La mancata fornitura dei file dei livelli di foratura impedisce di individuare ed evitare tempestivamente questi problemi durante la creazione dello stencil.<\/p>\n

    \"\"<\/p>\n

    Inoltre, la fretta di creare stencil senza un'ispezione fisica del PCB<\/a> La scheda nuda pu\u00f2 causare problemi. Quando i clienti non forniscono i file dei livelli di foratura, durante la creazione dello stencil possono verificarsi problemi come fori passanti imprevisti, con conseguenti anomalie di saldatura.<\/p>\n

    Per ridurre questi problemi, \u00e8 essenziale valutare i fori passanti per i trucioli, mantenere una distanza tra tfori passanti e SMD<\/a>e comprendere l'importanza dei processi di galvanotecnica a resina a foro chiuso in PCB<\/a> design.\"\"<\/p>\n

    In sintesi, evitando i fori passanti per la piastra e garantendo la fornitura di file di strati di foratura per la progettazione degli stencil, \u00e8 possibile migliorare notevolmente la qualit\u00e0 della saldatura. Questo non solo favorisce l'identificazione precisa dei fori, ma evita anche fori inutili o insufficienti, scongiurando cos\u00ec potenziali rischi per la qualit\u00e0 dovuti a scelte progettuali sbagliate.<\/p>","protected":false},"excerpt":{"rendered":"

    When it comes to Surface Mount Technology (SMT) production, cases of welding failure caused by missing drill files are not uncommon. Solder paste printing in SMT welding is a crucial and rather complex process, with data suggesting that 60-70% of defects in SMT production stem from solder paste printing. Interestingly, these defects are not equipment-related […]<\/p>","protected":false},"author":3,"featured_media":1896,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_joinchat":[],"footnotes":""},"categories":[16],"tags":[],"class_list":["post-1893","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"yoast_head":"\nAddressing Welding Failures in SMT Production<\/title>\n<meta name=\"description\" content=\"Explore the impact of missing drill files in Surface Mount Technology (SMT) production, uncovering the causes of welding failures\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.mintecinno.com\/it\/addressing-welding-failures-in-smt-production-due-to-missing-drill-files\/\" \/>\n<meta property=\"og:locale\" content=\"it_IT\" \/>\n<meta property=\"og:type\" 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