{"id":1893,"date":"2023-12-01T14:16:27","date_gmt":"2023-12-01T14:16:27","guid":{"rendered":"https:\/\/www.mintecinno.com\/?p=1893"},"modified":"2024-04-09T03:45:41","modified_gmt":"2024-04-09T03:45:41","slug":"addressing-welding-failures-in-smt-production-due-to-missing-drill-files","status":"publish","type":"post","link":"https:\/\/www.mintecinno.com\/pt_br\/addressing-welding-failures-in-smt-production-due-to-missing-drill-files\/","title":{"rendered":"Como lidar com falhas de soldagem na produ\u00e7\u00e3o SMT devido \u00e0 falta de arquivos de perfura\u00e7\u00e3o"},"content":{"rendered":"

Quando se trata da tecnologia de montagem em superf\u00edcie (SMT<\/a>), n\u00e3o s\u00e3o raros os casos de falhas de soldagem causadas pela falta de limas de perfura\u00e7\u00e3o.<\/p>\n

Impress\u00e3o de pasta de solda em SMT<\/a> A soldagem \u00e9 um processo crucial e bastante complexo, com dados que sugerem que 60-70% dos defeitos em SMT<\/a> produ\u00e7\u00e3o s\u00e3o decorrentes da impress\u00e3o da pasta de solda.<\/p>\n

\u00c9 interessante notar que esses defeitos n\u00e3o est\u00e3o relacionados ao equipamento, mas surgem principalmente durante as avalia\u00e7\u00f5es de engenharia e otimiza\u00e7\u00f5es de est\u00eancil. Em particular, a aus\u00eancia de arquivos de perfura\u00e7\u00e3o durante a engenharia pode levar a v\u00e1rios SMT<\/a> defeitos de soldagem.<\/p>\n

De acordo com os dados fornecidos pelo Departamento de Engenharia da Empresa E nas principais f\u00e1bricas de soldagem, cerca de 15% de SMT<\/a> casos de soldagem n\u00e3o possuem arquivos de camada de perfura\u00e7\u00e3o. Essa omiss\u00e3o leva a pelo menos um ou mais pedidos di\u00e1rios em que os clientes n\u00e3o fornecem esses arquivos essenciais. Isso gera custos de comunica\u00e7\u00e3o significativos, estimados em cerca de 100 minutos por dia e mais de 43 horas por m\u00eas, decorrentes de trocas de e-mails entre engenheiros, PMC e clientes para confirmar e atender a esses requisitos.<\/p>\n

O est\u00eancil desempenha um papel fundamental na SMT<\/a> soldagem e requer uma abordagem sistem\u00e1tica al\u00e9m da simples perfura\u00e7\u00e3o. \u00c9 fundamental entender como evitar a entrada de estanho que causa problemas de soldagem, a necessidade de perfurar arquivos de camadas para o design de est\u00eancil e abordar v\u00e1rios casos reais.<\/p>\n

    \n
  1. Por exemplo, surgem problemas quando os furos nas bordas das almofadas de solda n\u00e3o s\u00e3o identificados devido \u00e0 aus\u00eancia de limas de perfura\u00e7\u00e3o. A consequ\u00eancia: solda insatisfat\u00f3ria, solda falsa e estanho inadequado em resistores ou conectores.\"\"<\/li>\n<\/ol>\n

    2. Da mesma forma, a falta de furos de preven\u00e7\u00e3o nas almofadas de solda de aterramento QFN resulta em entrada de estanho e solda falsa. Nesse caso, \u00e9 fundamental evitar ou aumentar o preenchimento de estanho nos furos para garantir cobertura suficiente. O n\u00e3o fornecimento de arquivos de camada de perfura\u00e7\u00e3o impede a detec\u00e7\u00e3o oportuna e a preven\u00e7\u00e3o de tais problemas durante a cria\u00e7\u00e3o do est\u00eancil.<\/p>\n

    \"\"<\/p>\n

    Al\u00e9m disso, a pressa em criar est\u00eanceis sem inspe\u00e7\u00e3o f\u00edsica do PCB<\/a> A placa nua pode levar a problemas. Quando os clientes n\u00e3o fornecem arquivos de camada de perfura\u00e7\u00e3o, problemas como furos de passagem de placa n\u00e3o previstos podem surgir durante a cria\u00e7\u00e3o do est\u00eancil, levando a anomalias de soldagem.<\/p>\n

    Para atenuar essas preocupa\u00e7\u00f5es, \u00e9 essencial avaliar os orif\u00edcios de passagem da placa quanto a cavacos, manter uma dist\u00e2ncia entre tfuros passantes e SMDs<\/a>e compreender a import\u00e2ncia dos processos de galvanoplastia de resina plug-hole em PCB<\/a> design.\"\"<\/p>\n

    Em resumo, ao evitar orif\u00edcios de passagem de chapa e garantir o fornecimento de arquivos de camada de perfura\u00e7\u00e3o para o design do est\u00eancil, a qualidade da soldagem pode ser significativamente aprimorada. Isso n\u00e3o apenas ajuda na identifica\u00e7\u00e3o precisa dos furos, mas tamb\u00e9m evita furos desnecess\u00e1rios ou insuficientes, evitando, assim, poss\u00edveis riscos \u00e0 qualidade devido a escolhas de projeto inadequadas.<\/p>","protected":false},"excerpt":{"rendered":"

    When it comes to Surface Mount Technology (SMT) production, cases of welding failure caused by missing drill files are not uncommon. Solder paste printing in SMT welding is a crucial and rather complex process, with data suggesting that 60-70% of defects in SMT production stem from solder paste printing. Interestingly, these defects are not equipment-related […]<\/p>","protected":false},"author":3,"featured_media":1896,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_joinchat":[],"footnotes":""},"categories":[16],"tags":[],"class_list":["post-1893","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"yoast_head":"\nAddressing Welding Failures in SMT Production<\/title>\n<meta name=\"description\" content=\"Explore the impact of missing drill files in Surface Mount Technology (SMT) production, uncovering the causes of welding failures\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.mintecinno.com\/pt_br\/addressing-welding-failures-in-smt-production-due-to-missing-drill-files\/\" \/>\n<meta property=\"og:locale\" content=\"pt_BR\" \/>\n<meta property=\"og:type\" 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