MINTEC
PCB rigido
Lorem ipsum dolor sit amet, consectetuer adipiscing elit. Enea commodo ligula eget dolor. Enea massa. Cum sociis natoque penatibus et magnis dis parturient montes
MTI SMT
SMT assembly involves placing components flat on the surface of the PCB and then running the assembly through a baking oven. In cases of small production runs, we may utilize tweezers to carefully position components on the PCB if it offers time and cost savings for our customers. For high-volume or precision-centric requirements, we employ specialized machines. Machine preparation may take anywhere from a few hours to a full day.
At our production facility, we have the capability to handle various SMT types, including:
- Ball Grid Array (BGA)
- Ultra-Fine Ball Grid Array (uBGA)
- Quad Flat Pack No-Lead (QFN)
- Quad Flat Package (QFP)
- Small Outline Integrated Circuit (SOIC)
- Plastic Leaded Chip Carrier (PLCC)
- Package-On-Package (PoP)
MTI comprehensive range of SMT capabilities allows us to accommodate diverse customer needs, ensuring efficient and precise assembly of components.
Interested in our SMT Assembly?
Ottenete un preventivo personalizzato che si adatti al vostro piano!
