BGA (Ball Grid Array) PCB
Shenzhen Mintec Innovation Technology Industry was established in 2004 and is a high-tech enterprise that provides PCB design, manufacturing and assembly services to global customers. The company has factories in Shenzhen, Guangzhou and other places, focusing on providing PCB manufacturing and PCB assembly (PCBA) services to global electronic companies. Our products mainly include metal circuit boards,double-sided,flexible boards (FPC),high-precision HDI,multi-layer circuit boards,rigid-flex boards (including HDI), etc. It has obtained CSA,IC,FCC,CE and other certifications.
We provide comprehensive one-stop PCB solutions to reduce costs. Our product application areas cover industrial,automotive industries,telecommunication,IOT,etc. With fast response services and global supply capabilities, we have won long-term cooperation and praise from many companies.
BGA (Ball Grid Array) PCB is one of our PCB products. We will introduce its detailed parameter information and our company advantages to you.
Tous nos produits sont strictement conformes aux réglementations RoHS/REACH, avec des prix abordables et une qualité inégalée. Le service OEM/ODM est disponible. Nous avons une grande expérience dans l'exportation et la gestion de projet, pour assurer votre commande 100%.
| Nom du produit | BGA (Ball Grid Array) PCB |
| Nom de la marque | MTI |
| Lieu d'origine | Shenzhen, Guangdong |
| Type de produit | PCB |
| Certificat | UL,FCC,IC… |
| Garantie | 1 an |
| Port | Shenzhen |
| Application | LED lighting,automotive industries,industrial...etc |
| Service après-vente | Service 24 heures |
| Délai d'exécution (jours) | 5-15(à négocier) |
A noter: Les données du tableau ci-dessus sont données à titre indicatif. Pour des informations spécifiques, veuillez nous contacter.
Capacités de conception de MTI ID et MD
This layout shows the exact appearance and placement of the components on BGA (Ball Grid Array) PCB.
SCHEMATIC DESIGN of BGA (Ball Grid Array) PCB
