BGA (Ball Grid Array) PCB

PCBA

Shenzhen Mintec Innovation Technology Industry was established in 2004 and is a high-tech enterprise that provides PCB design, manufacturing and assembly services to global customers. The company has factories in Shenzhen, Guangzhou and other places, focusing on providing PCB manufacturing and PCB assembly (PCBA) services to global electronic companies. Our products mainly include metal circuit boards,double-sided,flexible boards (FPC),high-precision HDI,multi-layer circuit boards,rigid-flex boards (including HDI), etc. It has obtained CSA,IC,FCC,CE and other certifications.

We provide comprehensive one-stop PCB solutions to reduce costs. Our product application areas cover industrial,automotive industries,telecommunication,IOT,etc. With fast response services and global supply capabilities, we have won long-term cooperation and praise from many companies.

BGA (Ball Grid Array) PCB is one of our PCB products. We will introduce its detailed parameter information and our company advantages to you.

Alle unsere Produkte sind streng nach RoHS/REACH-Vorschriften, mit erschwinglichen Preisen mit unvergleichlicher Qualität.Wir kümmern uns um unsere Produktqualität, jeder Fehler der Ware, werden wir die Verantwortung übernehmen. Wir haben volle Erfahrung im Export und Projektmanagement, um Ihre Bestellung 100% zu sichern.

Produktname BGA (Ball Grid Array) PCB
Markenname MTI
Ort der Herkunft Shenzhen, Guangdong
Produkttyp PCB
Zertifikat UL,FCC,IC…
Garantie 1 Jahre
Hafen Shenzhen
Anmeldung LED lighting,automotive industries,industrial...usw.
Nachverkaufs-Service 24-Stunden-Dienst
Vorlaufzeit (Tage) 5-15(noch zu verhandeln)

 Bitte beachten Sie: Die Daten in der obigen Tabelle dienen nur als Referenz. Für spezifische Informationen, bitte Kontaktieren Sie uns.

MTI ID und MD Design-Fähigkeiten

This layout shows the exact appearance and placement of the components on BGA (Ball Grid Array) PCB.

SCHEMATIC DESIGN of BGA (Ball Grid Array) PCB