BGA (Ball Grid Array) PCB
Shenzhen Mintec Innovation Technology Industry was established in 2004 and is a high-tech enterprise that provides PCB design, manufacturing and assembly services to global customers. The company has factories in Shenzhen, Guangzhou and other places, focusing on providing PCB manufacturing and PCB assembly (PCBA) services to global electronic companies. Our products mainly include metal circuit boards,double-sided,flexible boards (FPC),high-precision HDI,multi-layer circuit boards,rigid-flex boards (including HDI), etc. It has obtained CSA,IC,FCC,CE and other certifications.
We provide comprehensive one-stop PCB solutions to reduce costs. Our product application areas cover industrial,automotive industries,telecommunication,IOT,etc. With fast response services and global supply capabilities, we have won long-term cooperation and praise from many companies.
BGA (Ball Grid Array) PCB is one of our PCB products. We will introduce its detailed parameter information and our company advantages to you.
Todos os nossos produtos estão estritamente de acordo com os regulamentos RoHS/REACH, com preços acessíveis e qualidade inigualável. Temos uma vasta experiência em exportação e gestão de projectos, para garantir a sua encomenda 100%.
| Nome do produto | BGA (Ball Grid Array) PCB |
| Nome da marca | MTI |
| Local de origem | Shenzhen,Guangdong |
| Tipo de produto | PCB |
| Certificado | UL,FCC,IC… |
| Garantia | 1 ano |
| Porto | Shenzhen |
| Aplicação | LED lighting,automotive industries,industrial...etc |
| Serviço pós-venda | Serviço 24 horas |
| Prazo de execução (dias) | 5-15(A negociar) |
Atenção: Os dados da tabela acima servem apenas de referência. Para informações específicas, por favor contactar-nos.
Capacidades de conceção de ID e MD da MTI
This layout shows the exact appearance and placement of the components on BGA (Ball Grid Array) PCB.
SCHEMATIC DESIGN of BGA (Ball Grid Array) PCB
